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Lead-free Reflow Soldering Free Training Web Seminar - 8/19/04 |
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Friday, 30 July 2004 |
Lead-free Reflow Soldering Free Training Web Seminar
Thursday, August 19 at 11:00am EST 2:00pm EST
It is clear that the electronics industry is on the move to lead-free assemblies. This trend is an effort to remove hazardous lead from electronic packages and reduce the dependency on lead materials that can leach into the environment during processing or eventual disposal.
Join Speedline Technologies to learn how the effort to go lead-free is driven by environmental considerations, governmental legislation, and the marketing advantages of lead-free electronic packages.
Topics will include:
- Equipment configurations and differences
- Producing lead-free assemblies
- Nitrogen process variables
- Cooling considerations
- Cost of operation
Go here to register for the free training web seminar. |
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Last Updated ( Thursday, 19 August 2004 )
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